Optical sensor device

ABSTRACT

A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an optical sensor device. Morespecifically, the present invention relates to a package structure ofthe optical sensor device.

2. Description of the Related Art

FIG. 11 is a sectional view illustrating an example of a related-artpackage (FIG. 2 of Japanese Patent Application Laid-open No.2002-198455). This package has the following structure. A package body21 includes a lead 25 and a cavity formed by a bottomed portion 23 andan inner side surface 24 that are made of a resin material. Asemiconductor element 22 is mounted on the bottomed portion 23 of thepackage body 21, and a lid 27 is provided on a package upper surface. Asurface of a part of the lead 25 is exposed from the bottomed portion23, and another part of the lead 25 is exposed to outside through thepackage formed of a resin molded portion so as to be used as an externalterminal. An electrode is formed on a surface of the element 22. Theelectrode formed on the surface of the element 22 and the lead 25exposed from the bottomed portion 23 of the cavity are electricallyconnected to each other through a wire 26. For example, in the case of alight-receiving sensor device having a light-receiving element mountedthereon, the light-receiving element receives light from an externallight source, including natural light. Alternatively, light from alight-emitting device is radiated to an object and the light-receivingelement receives light reflected from the object. Thus, a generatedelectromotive force can be transmitted from the electrode formed on thesurface of the element to outside through the lead 25 via the wire 26.

Further, FIG. 12 is a sectional view illustrating another example of arelated-art package (FIG. 1 of Japanese Patent Application Laid-open No.Hei 04-157759). This package has the following structure. An opticalsemiconductor element 22 and a wire 26 mounted on a die pad 27 and alead 25 forming a die pad and a lead are sealed with a transparent moldresin 28 formed of an epoxy resin, and a transparent plate member 29made of glass or plastic is arranged on a surface of the transparentmold resin 28 in a direction immediately above the optical semiconductorelement 22. An upper surface of the optical semiconductor element 22serves as a light-receiving surface 22 a, and an electrode formed on theupper surface and a part of the lead 25 sealed with the transparent moldresin 28 are electrically connected to each other through the wire 26.The lead 25 is exposed to outside through the transparent mold resin 28so as to be used as an external lead. In the case where the opticalsemiconductor element 22 is used as, for example, a light-receivingsensor device having a light-receiving element mounted thereon, lightfrom outside passes through the transparent plate member 29 and throughthe transparent mold resin 28 to be received by the light-receivingsurface 22 a of the optical semiconductor element 22. Thus, a generatedelectromotive force can be transmitted from the electrode formed on thesurface of the element to outside through the lead 25 via the wire 26.

However, in the package structure described in Japanese PatentApplication Laid-open No. 2002-198455, the lead 25 is held only with theresin of the package body 21 forming the cavity. Specifically, a portionof the lead 25, excluding a part serving as the external terminalexposed to outside through the resin forming the cavity and a wirebonding portion exposed from the surface of the bottomed portion 23 ofthe cavity, is held only with the resin so as to be in close contacttherewith. In this structure, there are the following problems: theremoval preventing force of the lead is low; the holding area thereof issmall; and the lead surface made of a metal has low adhesion to theresin. Further, in the case where the part of the lead 25 serving as theexternal lead terminal is bent and cut, mechanical stress isconcentrated on a root portion between the molding resin and the lead 25exposed to outside from the molding resin, so that the resin is liableto be peeled and cracked. Further, a gap remains at an interface betweenthe lead 25 and the resin, with the result that the package has lowairtightness. Therefore, it is difficult to obtain a strong holdingforce of the lead 25. Further, there is also a problem in that water isliable to enter the package from outside, and in addition, ambientenvironment may change. Thus, it becomes more difficult to obtain highreliability.

Further, in the package structure described in Japanese PatentApplication Laid-open No. Hei 04-157759, the entire peripheries of theoptical semiconductor element 22, the wire 26, the die pad 27, and thelead 25 are sealed with the transparent mold resin 28, with the resultthat the contact area between the lead 25 and the transparent mold resin28 is increased, and the holding force of the lead 25 can also beincreased. However, even in the structure in which the periphery of thelead 25 is sealed with the transparent mold resin 28 formed of an epoxyresin, the adhesion between the metal and the resin is not sufficient,and there is a significant difference in expansion coefficient betweenthe metal and the resin. Thus, it cannot be considered that the adhesionbetween the die pad 27 and lead 25 and the transparent mold resin 28 issufficient, and a gap remains therebetween, which degrades airtightness.Further, in the case where the external lead is bent and cut in thestructure in which the lead 25 is sealed with the transparent mold resin28 formed of an epoxy resin, stress is concentrated on the transparentmold resin 28. Therefore, the transparent mold resin 28 is liable to becracked and chipped, and further, a gap is liable to be formed betweenthe transparent mold resin 28 and the lead 25. In addition, there is arisk in that an external appearance of the package may be impaired.Therefore, there is a demand for means for enhancing the adhesionbetween the lead and the resin, achieving strong resistance to stressduring processing, and increasing the holding force of the lead.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an optical sensordevice having a strong holding force of a lead even in the case where asemiconductor package is miniaturized and the number of lead terminalsis increased.

An optical sensor device according to one embodiment of the presentinvention includes an optical sensor device package having a packagestructure with a cavity. The package structure includes a glasssubstrate having a filter function, a first resin molded portion inwhich the entire peripheries of an inner lead and a die pad aresubjected to contact fitting molding through use of a resin so as to beintegrated, and a second resin molded portion in which the first resinmolded portion is arranged on a bottom surface of a bottom portion ofthe cavity and the periphery excluding a portion of the first resinmolded portion exposed from the bottom portion is subjected to contactfitting molding so as to form the cavity and an outer shape design ofthe package. An optical sensor element is bonded and fixed to a centerof the bottomed portion of the resin molded package having the cavitythrough use of an adhesive, and the glass substrate having a filterfunction and an upper surface of the resin molded package having thecavity are bonded and fixed to each other through use of an adhesive.

Further, in the package, as the first resin molded portion, a moldedregion is used, in which the periphery of an inner lead serving as ametallized wire bonding portion made of a metal exposed from thebottomed portion of the cavity and the periphery of a die pad portion towhich the optical sensor element is to be bonded and fixed areintegrated by resin molding.

Further, as the second resin molded portion, a molded region is used,which is subjected to contact fitting molding with the first resinmolded portion and which forms the cavity and the entire package byresin molding, with the first resin molded portion being arranged on thebottom surface of the bottomed portion of the cavity.

Further, as the glass substrate having a filter function, a glasssubstrate having visibility characteristics or characteristics ofblocking ultraviolet light or infrared light is used.

Further, the glass substrate having a filter function and the uppersurface of the package having the cavity, which is molded with theresin, are bonded and fixed to each other through use of an adhesive.

Further, as the resin to be used for the first resin molded portion, anon-transparent resin or a resin having a light-blocking property isused. As the resin to be used for the second resin molded portion, anon-transparent resin, a resin having a light-blocking property, or aresin having reflectivity is used.

Further, in a structure in which the die pad portion is made of the samemetal as that forming the lead, a suspension lead for connecting the diepad portion to an outer periphery of a frame is cut off after theperipheries of the lead and the die pad portion are molded with thefirst resin molded portion so that the second resin molded portioncovers a cut surface of the suspension lead of the die pad portion bymolding.

The optical sensor device according to one embodiment of the presentinvention can have a hollow structure in which the optical sensorelement is sealed. In addition, the peripheries of the lead having thewire bonding portion exposed and the die pad are subjected to contactfitting molding with the first resin molded portion integrated by resinmolding, and the periphery of the first resin molded portion, in whichthe wire bonding portion and the die pad surface are arranged on thebottomed portion, is subjected to contact fitting molding with thesecond resin molded portion so as to form the integrated packagestructure having the cavity. Thus, in a structure in which the peripheryof the optical sensor element is molded with a resin, stress applied tothe optical sensor element is removed. Moreover, the interface betweenthe die pad and lead and the resin is allowed to have high adhesion andhigh airtightness, and contact fitting with a strong holding force ofthe lead can be achieved.

Further, the lead is bent and cut so as to also serve as the externallead terminal. The first resin molded portion and the second resinmolded portion hold the lead. Therefore, at least mechanical stressapplied to the lead can be received and alleviated by the second resinmolded portion. In addition, the lead held even by the first resinmolded portion is less liable to receive stress, and water and the likecan be prevented from entering the package. Therefore, even in a packagehaving a risk in that the factor for degrading reliability may beincreased due to the increase in number of lead terminals, based on thefact that the mechanical stress and the entrance path of the water andthe like increase in proportional to the number of the external leadterminals, an optical sensor device excellent in stability ofcharacteristics and reliability can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view schematically illustrating a configuration ofan optical sensor device according to one embodiment of the presentinvention.

FIGS. 2A to 2C are sectional views and a front view schematicallyillustrating a configuration of an optical sensor device according to asecond embodiment of the present invention.

FIG. 3 is a sectional view schematically illustrating a configuration ofan optical sensor device according to a third embodiment of the presentinvention.

FIG. 4 is a sectional view schematically illustrating a configuration ofan optical sensor device according to a fourth embodiment of the presentinvention.

FIG. 5 is a sectional view schematically illustrating a configuration ofan optical sensor device according to a fifth embodiment of the presentinvention.

FIG. 6 is a sectional view schematically illustrating a configuration ofan optical sensor device according to a sixth embodiment of the presentinvention.

FIG. 7 is a sectional view schematically illustrating a configuration ofan optical sensor device according to a seventh embodiment of thepresent invention.

FIG. 8 is a sectional view schematically illustrating a configuration ofan optical sensor device according to an eighth embodiment of thepresent invention.

FIG. 9 is a sectional view schematically illustrating a configuration ofan optical sensor device according to a ninth embodiment of the presentinvention.

FIG. 10 is a sectional view schematically illustrating a configurationof an optical sensor device according to a tenth embodiment of thepresent invention.

FIG. 11 is a sectional view schematically illustrating a configurationof a related-art optical sensor device.

FIG. 12 is a sectional view schematically illustrating a configurationof a related-art optical sensor device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An optical sensor device according to one embodiment of the presentinvention includes a glass substrate having a filter function, a resinmolded portion having a cavity, a lead integrated by resin molding, andan optical sensor element mounted on a die pad portion provided on abottomed portion of the cavity so as to be electrically connected to thelead. The optical sensor device has a hollow structure in which theoptical sensor element is fixed so as to be surrounded by the glasssubstrate having a filter function and the resin molded portion havingthe cavity. The resin molded portion having the cavity forms a packagehaving a double molding structure in which a first resin molded portionand a second resin molded portion are subjected to contact fittingmolding. In the first resin molded portion, the periphery of the die padportion and the periphery of a part of the lead in which a wire bondingportion is exposed are subjected to resin molding so as to beintegrated. In the second resin molded portion, the periphery of thefirst resin molded portion arranged on the bottomed portion of thecavity is molded with a resin so as to form an outer shape of thepackage.

The resin molded portion having the cavity includes the first resinmolded portion in which the periphery of the die pad portion and theperiphery of the part of the lead in which the wire bonding portion isexposed are subjected to contact fitting molding through use of a resinso as to be integrated, and the second resin molded portion in which theperiphery of the first resin molded portion arranged on the bottomedportion of the cavity is subjected to contact fitting molding throughuse of a resin so as to form the outer shape of the package having thecavity. The optical sensor element to be mounted on the die pad portionon the bottomed portion of the cavity and the wire bonding portion,which is one end of the lead exposed to the bottomed portion, areelectrically connected to each other. The other end of the lead isexposed to outside through the first resin molded portion and the secondresin molded portion so as to be used as an external lead terminal.

The resin molded portion having the cavity is made of a non-transparentresin or a resin having light-blocking property, or a resin havingreflectivity, and the resin is formed of a thermoplastic resin or athermosetting resin. The glass substrate having a filter function andthe resin molded portion having the cavity are fixed and bonded to eachother by adhesion fitting.

Further, the resin molded portion having the cavity is formed of an areahaving an element mounting portion formed on the bottomed portion byresin molding and an area having the die pad portion made of a metal.

In a structure in which the die pad portion is made of the same metal asthat forming the lead, a suspension lead for connecting the die padportion to a frame is cut off after the first resin molded portion ismolded, and contact fitting molding is performed with the second resinmolded portion, with the result that a package structure in which a cutsurface of the suspension lead is not exposed is configured.

In the resins that form the resin molded portion, a resin having a glasstransition temperature and a heat distortion temperature that aresubstantially identical with or higher than those of the resin to beused for the second resin molded portion is used for the first resinmolded portion.

The first resin molded portion has a configuration in which a partthereof is exposed to the cavity and the periphery thereof is subjectedto contact fitting molding with the second resin molded portion.Alternatively, the first resin molded portion has a configuration inwhich the periphery thereof is subjected to contact fitting moldingwhile being accommodated in the second resin molded portion so as to beentirely covered therewith.

The glass substrate having a filter function is made of glass having afunction of blocking light having a specified wavelength. Alternatively,the glass substrate having a filter function is made of transparentglass having a multi-layer film of a metal oxide film formed thereon.Still alternatively, the glass substrate having a filter function ismade of transparent glass having a dye or a pigment, which has a filterfunction, applied or bonded thereto.

First Embodiment

Now, a configuration of an optical sensor device according to a firstembodiment of the present invention is described with reference to thedrawings.

FIG. 1 is a schematic vertical sectional view of an optical sensordevice 11 according to this embodiment. A resin molded portion having acavity 15 is formed of a double molding structure in which a first resinmolded portion 1 and a second resin molded portion 2 are subjected tocontact fitting molding. The first resin molded portion 1 has astructure in which a part of leads 3 a and 3 b made of metals issubjected to contact fitting molding through use of a resin, and anelement mounting portion 13 is integrally molded on a bottomed portionof the cavity 15. The peripheries of the leads 3 a and 3 b, excluding awire bonding portion 14 and a portion exposed to outside through apackage as an external lead terminal, are molded with the first resinmolded portion 1. The periphery of the first resin molded portion 1 issubjected to contact fitting with the second resin molded portion 2 toform the package structure having the cavity 15. The first resin moldedportion 1 forms the bottom portion and a part of an inner side surfaceof the cavity 15, and the second resin molded portion 2 forms theremaining inner side surface continuously from the first resin moldedportion 1. The second resin molded portion 2 is molded so as to have astructure in which a part including the element mounting portion 13 anda portion serving as the wire bonding portion 14 is exposed, to therebyform the package having the cavity 15. An optical sensor element 5 isbonded onto the element mounting portion 13 with an adhesive 7 so as tobe mounted thereon. The optical sensor element 5 and the wire bondingportion 14 provided on the leads 3 a and 3 b are electrically connectedto each other through a wire 6, and a part of the leads 3 a and 3 bexposed to outside of the package through the resin molded portionserves as the external lead terminal. The optical sensor device 11 has ahollow structure in which a glass substrate 4 having a filter functionis fixed and bonded to an upper surface of the resin molded portionhaving the cavity with an adhesive 10.

Due to a double molding structure in which the peripheries of theelement mounting portion 13 and the wire bonding portion 14 of the leads3 a and 3 b are integrated by resin molding, and a part of the leads 3 aand 3 b excluding a portion to be used as the external lead terminal andthe first resin molded portion 1 are subjected to contact fittingmolding with the second resin molded portion 2, the package can haveenhanced adhesion between the leads 3 a and 3 b and the resin andenhanced airtightness at an interface therebetween. In addition, thesecond resin molded portion 2 can receive and alleviate stress, whichconcentrates on a root portion between the resin and the external leadterminal to cause peeling and cracking of the resin along lead bending,cutting, and the like, and at least the first resin molded portion 1 canmaintain a state immediately after the molding. Therefore, the packageis allowed to have high airtightness that makes it difficult for water,gas, dust, and the like to enter the package from outside, and there isalso an effect for increasing the removal preventing force of the leads3 a and 3 b. The double molding structure in the package of thisembodiment aims at achieving the effect as a highly reliable packagestructure, and hence the use of the double molding structure is notparticularly limited to an optical sensor device.

In this case, portions of the leads 3 a and 3 b, which are to besubjected to contact fitting with the first resin molded portion 1, aresubjected to processing for enhancing the contact fitting force withrespect to the resin, such as roughening, grooving, and crushing, or areprovided with a structure for enhancing the contact fitting force withrespect to the resin. Further, it is possible to provide portions of theleads 3 a and 3 b, which are to be subjected to contact fitting with thesecond resin molded portion 2, with a lead that is subjected toroughing, grooving, and crushing, and with a lead that is not subjectedto such processing. Peeling and cracking of the resin can be preventedwith strong adhesion strength in the lead that is subjected to roughing,grooving, and crushing, in the case where the stress caused by bending,cutting, and the like of the external lead terminal concentrates on theroot portion between the external lead terminal and the second resinmolded portion 2. Alternatively, by allowing separation of the lead fromthe resin with respect to generated stress, without performing roughing,bending, grooving, and crushing, so as to create a state of alleviatingand dodging the stress, peeling and cracking of the resin can also beprevented. Further, in order to increase the contact fitting forcebetween the resins in the case of molding the second resin moldedportion, respective portions of an outer peripheral surface of the firstresin molded portion 1, which are to serve as a side surface, a bottomsurface, and an upper surface, may be provided with an uneven longgroove, a protrusion, or the like (not shown). Thus, in the first resinmolded portion 1, the second resin molded portion 2, and the leads 3 a,3 b, high airtightness can be achieved at an interface between the leads3 a and 3 b and the resin, and in addition, the removal preventing forceof the leads 3 a and 3 b can be increased due to the high holding forceof the leads 3 a and 3 b. Further, peeling and cracking of the resin isless liable to occur with respect to stress caused during processing ofthe external lead terminal and thermal stress caused during joining witha solder in the case of mounting on a mounting substrate, and thus aneffect of high reliability can be obtained.

Further, the glass substrate 4 having a filter function is made of glasshaving visibility characteristics or glass having a structure in whichglass having light-blocking property is formed on the periphery of glasshaving visibility characteristics. Alternatively, the glass substrate 4is made of glass having a structure in which a multi-layer film of ametal oxide film or the like is formed on transparent glass not havingspecified optical characteristics. Still alternatively, the glasssubstrate 4 is made of glass having a structure in which a film formedof an organic substance having visibility characteristics is bonded totransparent glass not having specified optical characteristics. Furtherstill alternatively, the glass substrate 4 is made of glass having astructure in which glass having characteristics of not transmittinglight in a short wavelength range and glass having characteristics ofnot transmitting light in an infrared wavelength range are laminatedwith each other. Thus, an effect that the glass substrate 4 has both astable filter function and high reliability can be obtained.

Further, as the resin to be used for the first resin molded portion 1, aresin is used, which has heat resistance equal to or higher than that ofthe resin to be used for the second resin molded portion 2. As thecharacteristics exhibiting heat resistance, the glass transitiontemperature and heat distortion temperature are used as guidelines.Thus, in the case of molding the second resin molded portion 2, thefirst resin molded portion 1 can be prevented from being softened orexpanded due to the molding temperature. Further, in the case where heatis transmitted from outside to the package, the second resin moldedportion 2 provided on an outer side is exposed to high temperature ascompared to the first resin molded portion 1 due to the ambienttemperature and the heat reaching the package through the external leadterminal, and hence damages to the first resin molded portion 1 havingthe optical sensor element 5 mounted thereon can be reduced.

Further, the resin generally expands due to high temperature. However,when the first resin molded portion 1 is made of a resin having heatresistance equal to or higher than that of the resin to be used for thesecond resin molded portion 2 and having a thermal expansion coefficientsmaller than that of the resin to be used for the second resin moldedportion 2, the resin to be used for the second resin molded portion 2expands earlier than the resin to be used for the first resin moldedportion 1. Thus, the periphery of the first resin molded portion 1 andthe peripheries of the leads 3 a and 3 b subjected to contact fittingmolding with the second resin molded portion 2 are compressed with theresin of the second resin molded portion 2, and hence a gap between theresin and the leads 3 a and 3 b can be closed at high temperature.Therefore, it is possible to achieve a structure and state in whichwater, dust, and the like are less liable to enter the package throughthe interface between the resin and the leads 3 a and 3 b, and hence aneffect for reducing the risk in that water and the like may reach theoptical sensor element 5 can be obtained.

Further, it is preferred that the resin to be used for the first resinmolded portion 1 be formed of a thermoplastic resin or thermosettingresin having light-blocking property, and that the resin to be used forthe second resin molded portion 2 be formed of a thermoplastic resin orthermosetting resin having light-blocking property, or a thermoplasticresin or thermosetting resin having reflectivity. Thus, the second resinmolded portion 2 can block or reflect light from outside, with theresult that light from the side surface or the back surface of thepackage is prevented from passing through the resin so as to enter theoptical sensor element 5 mounted in the cavity. Further, due to thefirst resin molded portion 1 having light-blocking property, of thelight that passes through the glass substrate 4 having a filter functionto enter the cavity, light that enters portions other than alight-receiving portion provided on an upper surface of the opticalsensor element 5 can be absorbed, and thus, incident light is preventedfrom being repeatedly reflected in the cavity. Accordingly, even in thecase where incident light that enters the optical sensor element 5 isreflected in the cavity to be received by the optical sensor element 5again, which occurs in a filter glass substrate having a structure inwhich a multi-layer film of a metal oxide film or the like is formed ontransparent glass, a filter glass substrate having a structure in whicha filter formed of an organic substance is bonded to transparent glass,and the like, and where light in an unnecessary wavelength band causedby angle dependency, in which the function of blocking light having aspecified wavelength is degraded due to an increase in incident angle,enters the optical sensor element 5, an effect that the optical sensorelement 5 has light-receiving sensitivity with angle dependencysuppressed can be expected.

Second Embodiment

FIG. 2A is a sectional view of an optical sensor device 11 according toa second embodiment of the present invention. FIG. 2B is a front view ofa first resin molded portion 1, and FIG. 2C is a sectional view thereof.FIG. 2A illustrates a cross section of a package body having a cavity,excluding a glass substrate 4 having a filter function, in the opticalsensor device 11. The optical sensor device 11 has a structure in whicha die pad portion 8 formed of a metal frame is provided on the firstresin molded portion 1. The first resin molded portion 1 has a structurein which the periphery of the die pad portion 8 formed of a metal frame,excluding a surface side on which an optical sensor element 5 is to bemounted, and the periphery of each lead, excluding a portion in which aframe surface to be used as a wire bonding portion is exposed, aremolded with a resin so as to be integrated.

Further, FIG. 2B illustrates a front view of the first resin moldedportion 1 having an integrated structure after being molded, and FIG. 2Cillustrates a sectional view thereof after being molded. The die padportion 8 formed of a metal frame generally has a state in which a partof the periphery thereof is connected to a suspension lead. In the diepad portion 8 immediately after the first resin molded portion 1 ismolded, a part of the periphery is still connected to the suspensionlead so that the periphery is held by the first resin molded portion 1.After the suspension lead is cut off, a cut surface of the suspensionlead is exposed from the first resin molded portion 1. The periphery ofthe first resin molded portion 1 in which the cut surface of thesuspension lead is exposed is subjected to contact fitting molding witha second resin molded portion 2, with the result that a package isobtained in which the cut surface of the suspension lead is not exposedto the resin molded surface. Therefore, even when the package has astructure in which the die pad portion 8 on which the optical sensorelement 5 is to be mounted is formed of a metal frame having thesuspension lead, the cut surface of the suspension lead is not exposedfrom the resin molded surface, and there is no interface between theresin and the lead on the die pad portion 8 on which the optical sensorelement 5 is to be mounted. Thus, an optical sensor device having highairtightness can be obtained in which the die pad portion 8 is formed asan element mounting portion having high airtightness without an entrancepath for water and the like, and the leads 3 a and 3 b and the die padportion 8 are strongly held and molded with the resin so as to have highadhesion.

Third Embodiment

FIG. 3 is a sectional view of an optical sensor device 11 according to athird embodiment of the present invention. In a first resin moldedportion 1, a part of a die pad portion 8 formed of a metal frame onwhich an optical sensor element 5 is to be mounted is molded so as toincrease thickness, and a bottom surface of the die pad portion 8 onwhich the optical sensor element 5 is to be mounted is exposed from asurface of a second resin molded portion 2 corresponding to a backsurface of a package. The bottom surface of the die pad portion 8 is notcovered with a resin forming the second resin forming portion 2. Thus, adouble molding structure is achieved which has a heat dissipationfunction capable of releasing heat, generated from the mounted opticalsensor element 5, to outside through an adhesive 7 via the die padportion 8.

Fourth Embodiment

FIG. 4 is a sectional view of an optical sensor device 11 according to afourth embodiment of the present invention. In a first resin moldedportion 1, the peripheries of leads 3 a and 3 b, excluding a portion inwhich a lead surface to be used as a wire bonding portion is exposed,are molded with the first resin molded portion 1, and the first resinmolded portion 1 forms the periphery of a bottom portion. An elementmounting portion 13 to be a center of the bottom portion on which anoptical sensor element 5 is to be mounted has a double molding structureprovided by molding with a second resin molded portion 2. In the case ofthis structure, compared to the first embodiment, the optical sensorelement 5 to be mounted on the bottom portion in a cavity is more liableto receive influence by the optical characteristics of the resin of thesecond resin molded portion 2.

Fifth Embodiment

FIG. 5 is a sectional view of an optical sensor device 11 according to afifth embodiment of the present invention. A double molding structure isachieved in which a first resin molded portion 1 is completely buried ina second resin molded portion 2 without being exposed from a bottomportion of a cavity. In the case of this structure, the opticalcharacteristics of a resin to be used for the second resin moldedportion 2 influence an optical sensor element 5 to be mounted on thebottom portion of the cavity, and the purpose of providing the firstresin molded portion 1 is to hold leads 3 a and 3 b, increase theremoval preventing force of the leads 3 a and 3 b, and achieve contactfitting.

Sixth Embodiment

FIG. 6 is a sectional view of an optical sensor device 11 according to asixth embodiment of the present invention. A cavity is not formed in adouble molding structure including a first resin molded portion 1 and asecond resin molded portion 2. The first resin molded portion 1 has astructure in which the peripheries of leads 3 a and 3 b, excluding aportion in which a lead surface to be used as a wire bonding portion isexposed, and the periphery of a die pad portion 8 formed of a metalframe are molded with a resin so as to be integrated. In this case, theperiphery of the die pad portion 8, excluding a surface side on which anoptical sensor element 5 is to be mounted with an adhesive 7, issubjected to contact fitting molding through use of a resin.

The periphery of the die pad portion 8 formed of a metal frame isconnected to a suspension lead. In the die pad portion 8 immediatelyafter the first resin molded portion 1 is molded, the periphery of thedie pad portion 8 is still connected to the suspension lead so as to beheld by the first resin molded portion 1. After the suspension lead iscut off, a cut surface of the suspension lead is exposed from a sidesurface of the first resin molded portion 1, and the first resin moldedportion 1 having the cut surface of the suspension lead exposedtherefrom is subjected to contact fitting molding with a second resinmolded portion 2, with the result that a package is obtained in whichthe cut surface of the suspension lead is not exposed from a resinmolded surface. Therefore, even when the package has a structure inwhich the die pad portion 8 on which the optical sensor element 5 is tobe mounted is formed of a metal frame having the suspension lead, thecut surface of the suspension lead is not exposed from the resin moldedsurface, and there is no interface between the resin and the lead on thedie pad portion 8 on which the optical sensor element 5 is to bemounted. Thus, an optical sensor device having high airtightness can beobtained in which the die pad portion 8 is formed as an element mountingportion having high airtightness without an entrance path for water andthe like, and the leads 3 a and 3 b and the die pad portion 8 arestrongly held and molded with the resin so as to have high adhesion.

In this case, the die pad portion 8 may not have a structure using ametal frame and may be provided by molding with the first resin moldedportion 1. Further, the second resin molded portion 2 has a contactfitting molding structure so as to cover the entire periphery of thefirst resin molded portion 1 without forming openings. By using a resincontaining a filler of the finely pulverized glass substrate 4 having afilter function or a resin containing a dye or a pigment having a filterfunction as the resin for the second resin molded portion 2, an opticalsensor device having a filter function as well as the effect of thedouble molding structure can be obtained. Further, the second resinmolded portion 2 may be molded with a permeable resin not containing theabove-mentioned filler.

Seventh Embodiment

FIG. 7 is a sectional view of an optical sensor device 11 according to aseventh embodiment of the present invention. The optical sensor device11 has a structure in which a glass substrate 4 having a filter functionis provided on an upper surface of a translucent second resin moldedportion 2 forming an outer periphery of a double molding structure nothaving a cavity. Further, the thickness of a resin molded on an uppersurface side of a lead in the first resin molded portion 1 is set so asto be substantially the same as that of an optical sensor element 5after being mounted on a die pad portion 8. Thus, light can enter theoptical sensor element 5 from a front side while a light componentthereof having a specified wavelength is transmitted and absorbed by aglass substrate 4 having a filter function, and light that enters theoptical sensor element 5 from a back surface and a side surface thereofcan be blocked by the first resin molded portion 1.

Eighth Embodiment

FIG. 8 is a sectional view of an optical sensor device 11 according toan eighth embodiment of the present invention. The optical sensor device11 has a molding structure in which a concave portion is formed inadvance in an upper surface portion of a second resin molded portion 2,which corresponds to a front surface direction of an optical sensorelement 5, in a double molding structure not having a cavity. A resin 9containing a filler of a finely pulverized glass substrate 4 having afilter function or a resin 9 containing a dye or a pigment having afilter function is applied to the concave portion so as to obtain afilter function with respect to light that enters the optical sensorelement 5. As the resin to be used for the second resin molded portion2, a resin having translucency or a filter function is used. As theresin to be used for the first resin molded portion 1, a resin havinglight-blocking property is used. The thickness of a part of the secondresin molded portion 2 between an upper surface of the optical sensorelement 5 and a bottom of the concave portion formed in the second resinmolded portion 2 is small, and hence an effect that the optical sensorelement 5 is less liable to be influenced by the optical characteristicsof the resin of the second resin molded portion 2 can be obtained.Further, the bottom of the concave portion is provided with a curvature,and hence an effect that a sensor portion provided on the upper surfaceof the optical sensor element 5 can receive a condensed light flux canbe obtained.

Ninth Embodiment

FIG. 9 is a sectional view of an optical sensor device 11 according to aninth embodiment of the present invention. The optical sensor device 11has a structure in which a resin 9 containing a filler of finelypulverized glass having a filter function or a resin 9 containing a dyeor a pigment having a filter function is applied to an upper surface ofan optical sensor element 5 so as to have a predetermined thickness andwidth in a double molding structure not having a cavity. Further, theresin 9 containing a filler of finely pulverized glass having a filterfunction or the resin 9 containing a dye or a pigment having a filterfunction is formed into a tapered shape in which a side thereof incontact with the optical sensor element 5 is wider than the other side.Thus, the periphery of a portion to which the resin 9 having a filterfunction is applied is covered with the second resin molded portion 2,and the contact fitting property between the resin 9 and the secondresin molded portion 2 is enhanced. Therefore, the optical sensorelement 5 is not directly exposed to water and heat from outside, andhence an effect that the reliability of the resin 9 having a filterfunction hardly changes so as to be maintained for a long period of timecan be obtained.

Tenth Embodiment

FIG. 10 is a sectional view of an optical sensor device 11 according toa tenth embodiment of the present invention. The optical sensor device11 has a structure in which a die pad portion 8 is exposed from a secondresin molded portion 2 in a double molding structure not having acavity. The die pad portion 8 is formed of a metal frame so as to have aheat dissipation structure exposed from a surface of the second resinmolded portion 2. A first resin molded portion 1 has a molding structurein which the entire peripheries of the die pad portion 8 and the leads 3a and 3 b are integrated by contact fitting molding, with the thicknessof the first resin molded portion 1 on a side surface of the die padportion 8 being about a half that of the die pad portion 8. Theperiphery of the die pad portion 8, in which a side surface thereof isnot molded with the first resin molded portion 1, is subjected tocontact fitting molding with the second resin molded portion 2, and aback surface of the die pad portion 8 on which the optical sensorelement 5 is not to be mounted is exposed to outside. Thus, thefollowing effect can be expected. Specifically, even in the case wherethe die pad portion 8 having a heat dissipation structure is provided,the optical sensor device 11 has high airtightness in the same way as inthe interface between the external lead terminal and the second resinmolded portion 2. Further, the high holding force and the high removalpreventing force are achieved in the leads 3 a and 3 b and the die padportion 8.

In a miniaturized resin molded package having a lead, in which leadterminals are thinned and the number thereof is increased, a resinmolded portion is allowed to have a double molding structure. The doublemolding structure includes a first molding portion in which theperipheries of a wire bonding portion of a lead and a die pad portionare integrated, and a second molding portion in which the periphery ofthe first molding portion is molded so as to form an outer shape of thepackage. Those molding portions are subjected to contact fittingmolding. Thus, an optical sensor device having a highly reliable hollowstructure package can be provided in which the removal preventing forceof the lead held by the resin is increased, the adhesion between thelead and die pad portion and the resin is enhanced, and the airtightnessis significantly improved.

Further, this structure can also be used for a package having a closedsealing and molding structure not having a cavity. Thus, an opticalsensor device having a highly reliable package can be provided in whichthe adhesion between the lead and die pad portion and the resin isenhanced, the holding force and the removal preventing force of the leadare increased, and the airtightness is significantly improved. Throughuse of the package structure according to one embodiment of the presentinvention not only for an optical sensor device but also for otherdevices, it is possible to contribute to provision of equipment havingan optical sensor device mounted thereon and the like in considerationof the use for household electrical appliances, the use in vehicles oroutdoor use under a severe environment, or the use for the applicationin which an element having characteristics liable to change sensitivelydepending on the ambient environment is mounted.

What is claimed is:
 1. An optical sensor device, comprising: a die padportion; an optical sensor element disposed on the die pad portion; aplurality of leads formed separately around the die pad portion; a firstresin molding portion holding a periphery of the die pad portion andfirst peripheries of the plurality of leads excluding a portion in whicha surface of each of the plurality of leads used as a wire bondingportion is exposed after integration by contact fitting molding using afirst resin; a second resin molding portion covering an entire peripheryof the first resin molding portion and second peripheries of theplurality of leads by contact fitting molding using a second resin, thesecond resin molding portion having one of a resin with transparency, aresin containing a filler of finely pulverized glass having a firstfilter function, and a resin containing a dye or a pigment having asecond filter function; and a suspension lead connected to the die padportion, the suspension lead having a cut surface exposed from the firstresin molding portion, but not exposed from the second resin moldingportion.
 2. An optical sensor according to claim 1, further comprising aglass substrate having a filter function disposed on an upper surface ofthe second resin molding portion.
 3. An optical sensor device accordingto claim 1, further comprising a concave portion disposed in an uppersurface portion of the second resin molding portion and in front of theoptical sensor element, the inside of the concave portion being filledwith one of a resin containing a filler of finely pulverized glasshaving a third filter function and a resin containing a dye or a pigmenthaving a fourth filter function.
 4. An optical sensor device accordingto claim 1, further comprising a stucture having a tapered shape inwhich a side thereof in contact with the optical sensor element is widerthan another side, the structure being formed from one of a resincontaining a filler of finely pulverized glass having a fifth filterfunction and a resin containing a dye or a pigment having a sixth filterfunction, and the structure being covered with the second resin moldingportion.
 5. An optical sensor device according to claim 1, wherein thedie pad portion has a lower surface opposite to an upper surface onwhich the optical sensor element is disposed, the lower surface beingexposed from the second resin molding portion.
 6. An optical sensordevice, comprising: a die pad portion; an optical sensor elementdisposed on the die pad portion; a plurality of leads formed separatelyaround the die pad portion; a first resin molding portion holding aperiphery of the die pad portion and first peripheries of the pluralityof leads excluding a portion in which a surface of each of the pluralityof leads used as a wire bonding portion is exposed after integration bycontact fitting molding using a first resin; and a second resin moldingportion covering an entire periphery of the first resin molding portion,at least a part of an upper surface of the optical sensor element, andsecond peripheries of the plurality of leads by contact fitting moldingusing a second resin, the second resin molding portion having one of aresin with transparency, a resin containing a filler of finelypulverized glass having a first filter function, and a resin containinga dye or a pigment having a second filter function.
 7. An optical sensordevice according to claim 6, further comprising a glass substrate havinga filter function disposed on an upper surface of the second resinmolding portion.
 8. An optical sensor device according to claim 6,further comprising a concave portion disposed in an upper surfaceportion of the second resin molding portion and in front of the opticalsensor element, the inside of the concave portion being filled with oneof a resin containing a filler of finely pulverized glass having a thirdfilter function and a resin containing a dye or a pigment having afourth filter function being filled.
 9. An optical sensor deviceaccording to claim 6, further comprising a stucture having a taperedshape in which a side thereof in contact with the optical sensor elementis wider than another side, the structure being formed from one of aresin containing a filler of finely pulverized glass having a fifthfilter function and a resin containing a dye or a pigment having a sixthfilter function, and the structure being covered with the second resinmolding portion.
 10. An optical sensor device according to claim 6,wherein the die pad portion has a lower surface opposite to an uppersurface on which the optical sensor element is disposed, the lowersurface being exposed from the second resin molding portion.
 11. Anoptical sensor device according to claim 6, wherein the second resinmolding portion has one of a resin containing a filler of finelypulverized glass having a first filter function, and a resin containinga dye or pigment having a second filter function.